(kicad_pcb (version 20171130) (host pcbnew 5.1.0+dfsg1-1)
  (general
    (thickness 1.6)
    (drawings 0)
    (tracks 542)
    (zones 0)
    (modules 123)
    (nets 71)
  )
  (page A4)
  (layers
    (0 F.Cu signal)
    (31 B.Cu signal)
    (32 B.Adhes user)
    (33 F.Adhes user)
    (34 B.Paste user)
    (35 F.Paste user)
    (36 B.SilkS user)
    (37 F.SilkS user)
    (38 B.Mask user hide)
    (39 F.Mask user hide)
    (40 Dwgs.User user)
    (41 Cmts.User user hide)
    (42 Eco1.User user hide)
    (43 Eco2.User user hide)
    (44 Edge.Cuts user)
    (45 Margin user hide)
    (46 B.CrtYd user)
    (47 F.CrtYd user)
    (48 B.Fab user hide)
    (49 F.Fab user hide)
  )
  (setup
    (last_trace_width 0.1524)
    (user_trace_width 0.254)
    (user_trace_width 0.635)
    (user_trace_width 1.27)
    (trace_clearance 0.1524)
    (zone_clearance 0.09144)
    (zone_45_only no)
    (trace_min 0.1524)
    (via_size 0.6858)
    (via_drill 0.3302)
    (via_min_size 0.508)
    (via_min_drill 0.254)
    (user_via 0.508 0.254)
    (uvia_size 0.6858)
    (uvia_drill 0.3302)
    (uvias_allowed no)
    (uvia_min_size 0.2)
    (uvia_min_drill 0.1)
    (edge_width 0.1)
    (segment_width 0.2)
    (pcb_text_width 0.3)
    (pcb_text_size 1.5 1.5)
    (mod_edge_width 0.15)
    (mod_text_size 1 1)
    (mod_text_width 0.15)
    (pad_size 5 5)
    (pad_drill 0)
    (pad_to_mask_clearance 0.0508)
    (solder_mask_min_width 0.25)
    (aux_axis_origin 0 0)
    (visible_elements 7FFFEFFF)
    (pcbplotparams
      (layerselection 0x010fc_ffffffff)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (excludeedgelayer true)
      (linewidth 0.100000)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (padsonsilk false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory ""))
  )
  (net 0 "")
  (net 1 +3V3)
  (net 2 GND)
  (net 3 VDD)
  (net 4 /TAS3251/AVDD)
  (net 5 /TAS3251/DVDD)
  (net 6 "Net-(C9-Pad1)")
  (net 7 "Net-(C9-Pad2)")
  (net 8 "Net-(C10-Pad1)")
  (net 9 "Net-(C17-Pad2)")
  (net 10 "Net-(C18-Pad2)")
  (net 11 "Net-(C19-Pad2)")
  (net 12 "Net-(C20-Pad2)")
  (net 13 "Net-(C21-Pad2)")
  (net 14 /TAS3251/C_START)
  (net 15 /TAS3251/INB-)
  (net 16 /TAS3251/INB+)
  (net 17 /TAS3251/INA+)
  (net 18 /TAS3251/INA-)
  (net 19 SPK_INB-)
  (net 20 SPK_INB+)
  (net 21 SPK_INA-)
  (net 22 SPK_INA+)
  (net 23 15V)
  (net 24 "Net-(C47-Pad1)")
  (net 25 \CLIP_OTW)
  (net 26 "Net-(D1-Pad1)")
  (net 27 "Net-(D2-Pad1)")
  (net 28 \FAULT)
  (net 29 "Net-(D4-Pad2)")
  (net 30 "Net-(D5-Pad2)")
  (net 31 /TAS3251/OSC-IOM)
  (net 32 /TAS3251/OSC-IOP)
  (net 33 /TAS3251/FREQ_ADJ)
  (net 34 "Net-(J2-Pad8)")
  (net 35 "Net-(J2-Pad6)")
  (net 36 "Net-(J2-Pad4)")
  (net 37 MODE)
  (net 38 ADR)
  (net 39 /TAS3251/OC_ADJ)
  (net 40 /TAS3251/DAC_OUTB-)
  (net 41 /TAS3251/DAC_OUTB+)
  (net 42 /TAS3251/DAC_OUTA+)
  (net 43 /TAS3251/DAC_OUTA-)
  (net 44 MCLK)
  (net 45 BCLK)
  (net 46 LRCK)
  (net 47 SDIN)
  (net 48 SCL)
  (net 49 SDA)
  (net 50 +12V)
  (net 51 "Net-(C48-Pad2)")
  (net 52 \RESET-AMP)
  (net 53 \DAC_MUTE)
  (net 54 SDOUT)
  (net 55 /TAS3251/SPK_OUTA-)
  (net 56 /TAS3251/SPK_OUTB+)
  (net 57 /TAS3251/SPK_OUTB-)
  (net 58 /TAS3251/SPK_OUTA+)
  (net 59 OUTB-)
  (net 60 OUTB+)
  (net 61 OUTA-)
  (net 62 OUTA+)
  (net 63 "Net-(C46-Pad1)")
  (net 64 "Net-(C49-Pad1)")
  (net 65 "Net-(C49-Pad2)")
  (net 66 "Net-(C50-Pad2)")
  (net 67 "Net-(D3-Pad2)")
  (net 68 "Net-(D6-Pad2)")
  (net 69 "Net-(D6-Pad1)")
  (net 70 "Net-(R19-Pad1)")
  (net_class Default "Ceci est la Netclass par défaut."
    (clearance 0.1524)
    (trace_width 0.1524)
    (via_dia 0.6858)
    (via_drill 0.3302)
    (uvia_dia 0.6858)
    (uvia_drill 0.3302)
    (add_net +12V)
    (add_net +3V3)
    (add_net /TAS3251/AVDD)
    (add_net /TAS3251/C_START)
    (add_net /TAS3251/DAC_OUTA+)
    (add_net /TAS3251/DAC_OUTA-)
    (add_net /TAS3251/DAC_OUTB+)
    (add_net /TAS3251/DAC_OUTB-)
    (add_net /TAS3251/DVDD)
    (add_net /TAS3251/FREQ_ADJ)
    (add_net /TAS3251/INA+)
    (add_net /TAS3251/INA-)
    (add_net /TAS3251/INB+)
    (add_net /TAS3251/INB-)
    (add_net /TAS3251/OC_ADJ)
    (add_net /TAS3251/OSC-IOM)
    (add_net /TAS3251/OSC-IOP)
    (add_net /TAS3251/SPK_OUTA+)
    (add_net /TAS3251/SPK_OUTA-)
    (add_net /TAS3251/SPK_OUTB+)
    (add_net /TAS3251/SPK_OUTB-)
    (add_net 15V)
    (add_net ADR)
    (add_net BCLK)
    (add_net GND)
    (add_net LRCK)
    (add_net MCLK)
    (add_net MODE)
    (add_net "Net-(C10-Pad1)")
    (add_net "Net-(C17-Pad2)")
    (add_net "Net-(C18-Pad2)")
    (add_net "Net-(C19-Pad2)")
    (add_net "Net-(C20-Pad2)")
    (add_net "Net-(C21-Pad2)")
    (add_net "Net-(C46-Pad1)")
    (add_net "Net-(C47-Pad1)")
    (add_net "Net-(C48-Pad2)")
    (add_net "Net-(C49-Pad1)")
    (add_net "Net-(C49-Pad2)")
    (add_net "Net-(C50-Pad2)")
    (add_net "Net-(C9-Pad1)")
    (add_net "Net-(C9-Pad2)")
    (add_net "Net-(D1-Pad1)")
    (add_net "Net-(D2-Pad1)")
    (add_net "Net-(D3-Pad2)")
    (add_net "Net-(D4-Pad2)")
    (add_net "Net-(D5-Pad2)")
    (add_net "Net-(D6-Pad1)")
    (add_net "Net-(D6-Pad2)")
    (add_net "Net-(J2-Pad4)")
    (add_net "Net-(J2-Pad6)")
    (add_net "Net-(J2-Pad8)")
    (add_net "Net-(R19-Pad1)")
    (add_net OUTA+)
    (add_net OUTA-)
    (add_net OUTB+)
    (add_net OUTB-)
    (add_net SCL)
    (add_net SDA)
    (add_net SDIN)
    (add_net SDOUT)
    (add_net SPK_INA+)
    (add_net SPK_INA-)
    (add_net SPK_INB+)
    (add_net SPK_INB-)
    (add_net VDD)
    (add_net \CLIP_OTW)
    (add_net \DAC_MUTE)
    (add_net \FAULT)
    (add_net \RESET-AMP)
  )
  (module SamacSys_Parts:WE-HCF_201322 (layer F.Cu) (tedit 0)
    (at 150.876 144.272 90)
    (descr WE-HCF_201322)
    (tags Inductor)
    (attr smd)
    (fp_text reference L4 (at -3.46 -12.745 90) (layer F.SilkS))
    (fp_text value "10 µH" (at -3.46 -12.745 90) (layer F.SilkS) hide)
    (pad 3 smd rect (at 8.5 0 180) (size 5 5) (layers F.Cu F.Paste))
    (pad 2 smd rect (at -8.5 4.5 180) (size 5 5) (layers F.Cu F.Paste)
      (net 57 /TAS3251/SPK_OUTB-))
    (pad 1 smd rect (at -8.5 -4.5 180) (size 5 5) (layers F.Cu F.Paste)
      (net 59 OUTB-))
  )
  (module Capacitor_THT:C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3 (layer F.Cu) (tedit 5CBCCF99)
    (at 185.42 149.86 180)
    (descr "C, Rect series, Radial, pin pitch=15.00mm, , length*width=18*9mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf")
    (tags "C Rect series Radial pin pitch 15.00mm  length 18mm width 9mm Capacitor")
    (fp_text reference C32 (at 7.5 -5.75 180) (layer F.SilkS))
    (fp_text value 0.68µF (at 7.5 5.75 180) (layer F.Fab))
    (fp_text user %R (at 7.5 0 180) (layer F.Fab))
    (pad 2 thru_hole circle (at 15 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 1 thru_hole circle (at 0 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 59 OUTB-))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TAS3251:Advanced_ATS078036036-TI1OP-1099-C1-R1 (layer F.Cu) (tedit 4289BEAB)
    (at 145.6935 140.7255)
    (attr smd)
    (fp_text reference HS1 (at 0 0) (layer F.SilkS) hide)
    (fp_text value Heatsink (at 0 0) (layer F.SilkS))
    (pad 2 thru_hole circle (at 0 -18.4 270) (size 4.875 4.875) (drill 3.25) (layers *.Cu *.Paste *.Mask))
    (pad 1 thru_hole circle (at 0 18.4 90) (size 4.875 4.875) (drill 3.25) (layers *.Cu *.Paste *.Mask))
    (model ./wrlshp/12A597A6-E603.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 180))
    )
  )
  (module SamacSys_Parts:WE-PD_1030_105054 (layer B.Cu) (tedit 0)
    (at 134.05109 23.81933 270)
    (descr WE-PD_1030/105054)
    (tags Inductor)
    (attr smd)
    (fp_text reference L5 (at -8.8064 6.1957 270) (layer B.SilkS))
    (fp_text value "100 µH " (at -8.8064 6.1957 270) (layer B.SilkS) hide)
    (pad 2 smd rect (at 4.5 0 270) (size 2 3.5) (layers B.Cu B.Paste)
      (net 23 15V))
    (pad 1 smd rect (at -4.5 0 270) (size 2 3.5) (layers B.Cu B.Paste)
      (net 64 "Net-(C49-Pad1)"))
  )
  (module SamacSys_Parts:WE-HCF_201322 (layer F.Cu) (tedit 0)
    (at 182.88 116.84)
    (descr WE-HCF_201322)
    (tags Inductor)
    (attr smd)
    (fp_text reference L3 (at -3.46 -12.745) (layer F.SilkS))
    (fp_text value "10 µH" (at -3.46 -12.745) (layer F.SilkS) hide)
    (pad 3 smd rect (at 8.5 0 90) (size 5 5) (layers F.Cu F.Paste))
    (pad 2 smd rect (at -8.5 4.5 90) (size 5 5) (layers F.Cu F.Paste)
      (net 60 OUTB+))
    (pad 1 smd rect (at -8.5 -4.5 90) (size 5 5) (layers F.Cu F.Paste)
      (net 56 /TAS3251/SPK_OUTB+))
  )
  (module SamacSys_Parts:WE-HCF_201322 (layer F.Cu) (tedit 0)
    (at 182.88 86.36)
    (descr WE-HCF_201322)
    (tags Inductor)
    (attr smd)
    (fp_text reference L2 (at -3.46 -12.745) (layer F.SilkS))
    (fp_text value "10 µH" (at -3.46 -12.745) (layer F.SilkS) hide)
    (pad 3 smd rect (at 8.5 0 90) (size 5 5) (layers F.Cu F.Paste))
    (pad 2 smd rect (at -8.5 4.5 90) (size 5 5) (layers F.Cu F.Paste)
      (net 61 OUTA-))
    (pad 1 smd rect (at -8.5 -4.5 90) (size 5 5) (layers F.Cu F.Paste)
      (net 55 /TAS3251/SPK_OUTA-))
  )
  (module SamacSys_Parts:WE-HCF_201322 (layer F.Cu) (tedit 0)
    (at 154.94 50.8 180)
    (descr WE-HCF_201322)
    (tags Inductor)
    (attr smd)
    (fp_text reference L1 (at -3.46 -12.745 180) (layer F.SilkS))
    (fp_text value "10 µH" (at -3.46 -12.745 180) (layer F.SilkS) hide)
    (pad 3 smd rect (at 8.5 0 270) (size 5 5) (layers F.Cu F.Paste))
    (pad 2 smd rect (at -8.5 4.5 270) (size 5 5) (layers F.Cu F.Paste)
      (net 62 OUTA+))
    (pad 1 smd rect (at -8.5 -4.5 270) (size 5 5) (layers F.Cu F.Paste)
      (net 58 /TAS3251/SPK_OUTA+))
  )
  (module SamacSys_Parts:DIOM5226X240N (layer B.Cu) (tedit 0)
    (at 133.41609 9.84933)
    (descr SMA)
    (tags Diode)
    (attr smd)
    (fp_text reference D3 (at 0 0) (layer B.SilkS))
    (fp_text value D_Schottky (at 0 0) (layer B.SilkS) hide)
    (pad 2 smd rect (at 2.15 0 270) (size 1.55 2.35) (layers B.Cu B.Paste)
      (net 67 "Net-(D3-Pad2)"))
    (pad 1 smd rect (at -2.15 0 270) (size 1.55 2.35) (layers B.Cu B.Paste)
      (net 64 "Net-(C49-Pad1)"))
    (model "C:\\Users\\JMF\\Documents\\KiCAD additional Libraries\\SamacSys_Parts.3dshapes\\B1100-13-F.stp"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1210_3225Metric_Pad1.42x2.65mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 140.02009 6.68333 270)
    (descr "Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C44 (at 0 2.28 270) (layer B.SilkS))
    (fp_text value "2.2 µF" (at 0 -2.28 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 2.65) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 2.65) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 3 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1210_3225Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_5x5.8 (layer B.Cu) (tedit 5BCA39CF)
    (at 72.39 10.635 90)
    (descr "SMD capacitor, aluminum electrolytic, Panasonic, 5.0x5.8mm")
    (tags "capacitor electrolytic")
    (attr smd)
    (fp_text reference C42 (at 0 3.7 90) (layer B.SilkS))
    (fp_text value 100µF (at 0 -3.7 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 2.2 0 90) (size 3 1.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.15625)
      (net 2 GND))
    (pad 1 smd roundrect (at -2.2 0 90) (size 3 1.6) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.15625)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_5x5.8.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module SamacSys_Parts:SON80P400X400X80-11N (layer B.Cu) (tedit 0)
    (at 129.54 2.54)
    (descr DPR0010A)
    (tags "Integrated Circuit")
    (attr smd)
    (fp_text reference U4 (at 0 0) (layer F.SilkS))
    (fp_text value LM5010ASD_NOPB (at 0 0) (layer B.SilkS) hide)
    (pad 11 smd rect (at 0 0) (size 2.7 3.1) (layers B.Cu B.Paste)
      (net 2 GND))
    (pad 10 smd rect (at 1.95 1.6 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 69 "Net-(D6-Pad1)"))
    (pad 9 smd rect (at 1.95 0.8 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 51 "Net-(C48-Pad2)"))
    (pad 8 smd rect (at 1.95 0 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 70 "Net-(R19-Pad1)"))
    (pad 7 smd rect (at 1.95 -0.8 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 63 "Net-(C46-Pad1)"))
    (pad 6 smd rect (at 1.95 -1.6 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 66 "Net-(C50-Pad2)"))
    (pad 5 smd rect (at -1.95 -1.6 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 2 GND))
    (pad 4 smd rect (at -1.95 -0.8 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 2 GND))
    (pad 3 smd rect (at -1.95 0 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 67 "Net-(D3-Pad2)"))
    (pad 2 smd rect (at -1.95 0.8 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 65 "Net-(C49-Pad2)"))
    (pad 1 smd rect (at -1.95 1.6 270) (size 0.35 0.85) (layers B.Cu B.Paste)
      (net 64 "Net-(C49-Pad1)"))
    (model "C:\\Users\\JMF\\Documents\\KiCAD additional Libraries\\SamacSys_Parts.3dshapes\\LM5010ASD_NOPB.stp"
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 134.355 11.39)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R19 (at 0 -1.65) (layer F.SilkS))
    (fp_text value 182k (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 69 "Net-(D6-Pad1)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 70 "Net-(R19-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module MountingHole:MountingHole_4.3mm_M4_DIN965_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 78.74 152.4)
    (descr "Mounting Hole 4.3mm, M4, DIN965")
    (tags "mounting hole 4.3mm m4 din965")
    (attr virtual)
    (fp_text reference H5 (at 0 -4.75) (layer F.SilkS))
    (fp_text value MountingHole (at 0 4.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 7.5 7.5) (drill 4.3) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_4.3mm_M4_DIN965_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 200.66 40.64)
    (descr "Mounting Hole 4.3mm, M4, DIN965")
    (tags "mounting hole 4.3mm m4 din965")
    (attr virtual)
    (fp_text reference H4 (at 0 -4.75) (layer F.SilkS))
    (fp_text value MountingHole (at 0 4.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 7.5 7.5) (drill 4.3) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_4.3mm_M4_DIN965_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 200.66 152.4)
    (descr "Mounting Hole 4.3mm, M4, DIN965")
    (tags "mounting hole 4.3mm m4 din965")
    (attr virtual)
    (fp_text reference H3 (at 0 -4.75) (layer F.SilkS))
    (fp_text value MountingHole (at 0 4.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 7.5 7.5) (drill 4.3) (layers *.Cu *.Mask))
  )
  (module MountingHole:MountingHole_4.3mm_M4_DIN965_Pad (layer F.Cu) (tedit 56D1B4CB)
    (at 78.74 40.64)
    (descr "Mounting Hole 4.3mm, M4, DIN965")
    (tags "mounting hole 4.3mm m4 din965")
    (attr virtual)
    (fp_text reference H2 (at 0 -4.75) (layer F.SilkS))
    (fp_text value MountingHole (at 0 4.75) (layer F.Fab))
    (fp_text user %R (at 0.3 0) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0) (size 7.5 7.5) (drill 4.3) (layers *.Cu *.Mask))
  )
  (module Diode_SMD:D_SMA_Handsoldering (layer B.Cu) (tedit 58643398)
    (at 152.36 20.32)
    (descr "Diode SMA (DO-214AC) Handsoldering")
    (tags "Diode SMA (DO-214AC) Handsoldering")
    (attr smd)
    (fp_text reference D6 (at 0 2.5) (layer B.SilkS))
    (fp_text value D_Schottky (at 0 -2.6) (layer B.Fab))
    (fp_text user %R (at 0 2.5) (layer B.Fab))
    (pad 2 smd rect (at 2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
      (net 68 "Net-(D6-Pad2)"))
    (pad 1 smd rect (at -2.5 0) (size 3.5 1.8) (layers B.Cu B.Paste B.Mask)
      (net 69 "Net-(D6-Pad1)"))
    (model ${KISYS3DMOD}/Diode_SMD.3dshapes/D_SMA.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_6.3x5.8 (layer B.Cu) (tedit 5A841F9D)
    (at 101.44 15.24)
    (descr "SMT capacitor, aluminium electrolytic, 6.3x5.8, Nichicon ")
    (tags "Capacitor Electrolytic")
    (attr smd)
    (fp_text reference C47 (at 0 4.35) (layer B.SilkS))
    (fp_text value 47µF (at 0 -4.35) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 1 smd rect (at -2.7 0) (size 3.5 1.6) (layers B.Cu B.Paste B.Mask)
      (net 24 "Net-(C47-Pad1)"))
    (pad 2 smd rect (at 2.7 0) (size 3.5 1.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_6.3x5.8.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:CP_Elec_6.3x5.8 (layer B.Cu) (tedit 5A841F9D)
    (at 130.81 42.07 90)
    (descr "SMT capacitor, aluminium electrolytic, 6.3x5.8, Nichicon ")
    (tags "Capacitor Electrolytic")
    (attr smd)
    (fp_text reference C40 (at 0 4.35 90) (layer B.SilkS))
    (fp_text value 47µF (at 0 -4.35 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd rect (at -2.7 0 90) (size 3.5 1.6) (layers B.Cu B.Paste B.Mask)
      (net 3 VDD))
    (pad 2 smd rect (at 2.7 0 90) (size 3.5 1.6) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/CP_Elec_6.3x5.8.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:CP_Radial_D18.0mm_P7.50mm (layer F.Cu) (tedit 5AE50EF1)
    (at 159.385 79.375 180)
    (descr "CP, Radial series, Radial, pin pitch=7.50mm, , diameter=18mm, Electrolytic Capacitor")
    (tags "CP Radial series Radial pin pitch 7.50mm  diameter 18mm Electrolytic Capacitor")
    (fp_text reference C15 (at 3.75 -10.25 180) (layer F.SilkS))
    (fp_text value 2200µF (at 3.75 10.25 180) (layer F.Fab))
    (fp_text user %R (at 3.75 0 180) (layer F.Fab))
    (pad 2 thru_hole circle (at 7.5 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 1 thru_hole rect (at 0 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 3 VDD))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/CP_Radial_D18.0mm_P7.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:CP_Radial_D18.0mm_P7.50mm (layer F.Cu) (tedit 5AE50EF1)
    (at 159.385 123.19 180)
    (descr "CP, Radial series, Radial, pin pitch=7.50mm, , diameter=18mm, Electrolytic Capacitor")
    (tags "CP Radial series Radial pin pitch 7.50mm  diameter 18mm Electrolytic Capacitor")
    (fp_text reference C16 (at 3.75 -10.25 180) (layer F.SilkS))
    (fp_text value 2200µF (at 3.75 10.25 180) (layer F.Fab))
    (fp_text user %R (at 3.75 0 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 3 VDD))
    (pad 2 thru_hole circle (at 7.5 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/CP_Radial_D18.0mm_P7.50mm.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3 (layer F.Cu) (tedit 5AE50EF0)
    (at 185.42 137.16 180)
    (descr "C, Rect series, Radial, pin pitch=15.00mm, , length*width=18*9mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf")
    (tags "C Rect series Radial pin pitch 15.00mm  length 18mm width 9mm Capacitor")
    (fp_text reference C31 (at 7.5 -5.75 180) (layer F.SilkS))
    (fp_text value 0.68µF (at 7.5 5.75 180) (layer F.Fab))
    (fp_text user %R (at 7.5 0 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 60 OUTB+))
    (pad 2 thru_hole circle (at 15 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3 (layer F.Cu) (tedit 5AE50EF0)
    (at 186.563 63.5 180)
    (descr "C, Rect series, Radial, pin pitch=15.00mm, , length*width=18*9mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf")
    (tags "C Rect series Radial pin pitch 15.00mm  length 18mm width 9mm Capacitor")
    (fp_text reference C30 (at 7.5 -5.75 180) (layer F.SilkS))
    (fp_text value 0.68µF (at 7.5 5.75 180) (layer F.Fab))
    (fp_text user %R (at 7.5 0 180) (layer F.Fab))
    (pad 2 thru_hole circle (at 15 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 1 thru_hole circle (at 0 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 61 OUTA-))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_THT:C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3 (layer F.Cu) (tedit 5AE50EF0)
    (at 186.45 50.8 180)
    (descr "C, Rect series, Radial, pin pitch=15.00mm, , length*width=18*9mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf")
    (tags "C Rect series Radial pin pitch 15.00mm  length 18mm width 9mm Capacitor")
    (fp_text reference C29 (at 7.5 -5.75 180) (layer F.SilkS))
    (fp_text value 0.68µF (at 7.5 5.75 180) (layer F.Fab))
    (fp_text user %R (at 7.5 0 180) (layer F.Fab))
    (pad 1 thru_hole circle (at 0 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 62 OUTA+))
    (pad 2 thru_hole circle (at 15 0 180) (size 2.4 2.4) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_THT.3dshapes/C_Rect_L18.0mm_W9.0mm_P15.00mm_FKS3_FKP3.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_Molex:Molex_KK-254_AE-6410-04A_1x04_P2.54mm_Vertical (layer B.Cu) (tedit 5A15A247)
    (at 117.856 114.427 180)
    (descr "Molex KK-254 Interconnect System, old/engineering part number: AE-6410-04A example for new part number: 22-27-2041, 4 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator")
    (tags "connector Molex KK-254 side entry")
    (fp_text reference J1 (at 3.81 4.12 180) (layer B.SilkS))
    (fp_text value "Oscill sync" (at 3.81 -4.08 180) (layer B.Fab))
    (fp_text user %R (at 3.81 2.22 180) (layer B.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 32 /TAS3251/OSC-IOP))
    (pad 2 thru_hole oval (at 2.54 0 180) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 3 thru_hole oval (at 5.08 0 180) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 4 thru_hole oval (at 7.62 0 180) (size 1.74 2.2) (drill 1.2) (layers *.Cu *.Mask)
      (net 31 /TAS3251/OSC-IOM))
    (model ${KISYS3DMOD}/Connector_Molex.3dshapes/Molex_KK-254_AE-6410-04A_1x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x04_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 112.884814 129.466526 90)
    (descr "Through hole straight pin header, 2x04, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x04 2.54mm double row")
    (fp_text reference J2 (at 1.27 -2.33 90) (layer F.SilkS))
    (fp_text value "Freq Adjust" (at 1.27 9.95 90) (layer F.Fab))
    (fp_text user %R (at 1.27 3.81 180) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /TAS3251/FREQ_ADJ))
    (pad 2 thru_hole oval (at 2.54 0 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 1 +3V3))
    (pad 3 thru_hole oval (at 0 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /TAS3251/FREQ_ADJ))
    (pad 4 thru_hole oval (at 2.54 2.54 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 36 "Net-(J2-Pad4)"))
    (pad 5 thru_hole oval (at 0 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /TAS3251/FREQ_ADJ))
    (pad 6 thru_hole oval (at 2.54 5.08 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 35 "Net-(J2-Pad6)"))
    (pad 7 thru_hole oval (at 0 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 33 /TAS3251/FREQ_ADJ))
    (pad 8 thru_hole oval (at 2.54 7.62 90) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 34 "Net-(J2-Pad8)"))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x04_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TerminalBlock_Phoenix:TerminalBlock_Phoenix_MKDS-3-2-5.08_1x02_P5.08mm_Horizontal (layer F.Cu) (tedit 5B294F11)
    (at 195.58 68.58 90)
    (descr "Terminal Block Phoenix MKDS-3-2-5.08, 2 pins, pitch 5.08mm, size 10.2x11.2mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix")
    (tags "THT Terminal Block Phoenix MKDS-3-2-5.08 pitch 5.08mm size 10.2x11.2mm^2 drill 1.3mm pad 2.6mm")
    (fp_text reference J3 (at 2.54 -6.96 90) (layer F.SilkS))
    (fp_text value OUTA (at 2.54 6.36 90) (layer F.Fab))
    (fp_text user %R (at 2.54 3.1 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 61 OUTA-))
    (pad 2 thru_hole circle (at 5.08 0 90) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 62 OUTA+))
    (model ${KISYS3DMOD}/TerminalBlock_Phoenix.3dshapes/TerminalBlock_Phoenix_MKDS-3-2-5.08_1x02_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TerminalBlock_Phoenix:TerminalBlock_Phoenix_MKDS-3-2-5.08_1x02_P5.08mm_Horizontal (layer F.Cu) (tedit 5B294F11)
    (at 114.935 43.815)
    (descr "Terminal Block Phoenix MKDS-3-2-5.08, 2 pins, pitch 5.08mm, size 10.2x11.2mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix")
    (tags "THT Terminal Block Phoenix MKDS-3-2-5.08 pitch 5.08mm size 10.2x11.2mm^2 drill 1.3mm pad 2.6mm")
    (fp_text reference J5 (at 2.54 -6.96) (layer F.SilkS))
    (fp_text value PVDD (at 2.54 6.36) (layer F.Fab))
    (fp_text user %R (at 2.54 3.1) (layer F.Fab))
    (pad 2 thru_hole circle (at 5.08 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 3 VDD))
    (pad 1 thru_hole rect (at 0 0) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/TerminalBlock_Phoenix.3dshapes/TerminalBlock_Phoenix_MKDS-3-2-5.08_1x02_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TerminalBlock_Phoenix:TerminalBlock_Phoenix_MKDS-3-2-5.08_1x02_P5.08mm_Horizontal (layer F.Cu) (tedit 5CBCD046)
    (at 197.612 139.7 90)
    (descr "Terminal Block Phoenix MKDS-3-2-5.08, 2 pins, pitch 5.08mm, size 10.2x11.2mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix")
    (tags "THT Terminal Block Phoenix MKDS-3-2-5.08 pitch 5.08mm size 10.2x11.2mm^2 drill 1.3mm pad 2.6mm")
    (fp_text reference J4 (at 2.54 -6.96 90) (layer F.SilkS))
    (fp_text value OUTB (at 2.54 6.36 90) (layer F.Fab))
    (fp_text user %R (at 2.54 3.1 90) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 90) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 59 OUTB-))
    (pad 2 thru_hole circle (at 5.08 0 90) (size 2.6 2.6) (drill 1.3) (layers *.Cu *.Mask)
      (net 60 OUTB+))
    (model ${KISYS3DMOD}/TerminalBlock_Phoenix.3dshapes/TerminalBlock_Phoenix_MKDS-3-2-5.08_1x02_P5.08mm_Horizontal.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_Pad_D1.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 106.68 119.888)
    (descr "SMD pad as test Point, diameter 1.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP21 (at 0 -1.448) (layer F.SilkS))
    (fp_text value FAULT (at 0 1.55) (layer F.Fab))
    (fp_text user %R (at 0 -1.45) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
      (net 28 \FAULT))
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 119.38 94.86 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C1 (at 3.303748 0.315 90) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 117.348 94.878 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C2 (at 3.42 0 -90) (layer F.SilkS))
    (fp_text value 0.1µF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 137.16 88.51 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C3 (at -3.039 0.127) (layer F.SilkS))
    (fp_text value 0.1µF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 139.7 88.51 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C4 (at -3.039 -0.127) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 118.355 99.695 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C5 (at 3.03 0 180) (layer F.SilkS))
    (fp_text value 0.1µF (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 50 +12V))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 135.128 110.372 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C6 (at -0.118 1.778 270) (layer F.SilkS))
    (fp_text value 0.1µF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 50 +12V))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 118.11 105.655 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C7 (at 3.057 0 270) (layer F.SilkS))
    (fp_text value 1µF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 4 /TAS3251/AVDD))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 115.57 105.8 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C8 (at -3.547 0 90) (layer F.SilkS))
    (fp_text value 1µF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 5 /TAS3251/DVDD))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 121.92 93.59 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C9 (at -2.785 0 270) (layer F.SilkS))
    (fp_text value 2.2µF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 6 "Net-(C9-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 7 "Net-(C9-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 118.355 97.79 180)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C10 (at 3.311 -0.254 180) (layer F.SilkS))
    (fp_text value 0.1µF (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 8 "Net-(C10-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5CA11503)
    (at 138.811 98.6425 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C11 (at 0 -1.82 90) (layer F.SilkS))
    (fp_text value 1µF (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 VDD))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175)
      (net 2 GND) (zone_connect 1) (thermal_width 0.1) (thermal_gap 0.1))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 138.811 103.7225 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C12 (at 0 2.032 270) (layer F.SilkS))
    (fp_text value 1µF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 141.224 98.6425 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C13 (at 0 2.286 90) (layer F.SilkS))
    (fp_text value 1µF (at 0 1.82 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 141.224 103.7225 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C14 (at 0 -1.82 270) (layer F.SilkS))
    (fp_text value 1µF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 3 VDD))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 140.97 93.1 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C17 (at -0.245 1.27 270) (layer F.SilkS))
    (fp_text value 0.033µF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 9 "Net-(C17-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 58 /TAS3251/SPK_OUTA+))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 138.684 110.118 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C18 (at -3.42 0 90) (layer F.SilkS))
    (fp_text value 0.033µF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 10 "Net-(C18-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 56 /TAS3251/SPK_OUTB+))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 119.38 91.05 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C19 (at 4.055 0 90) (layer F.SilkS))
    (fp_text value 1µF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 11 "Net-(C19-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 138.43 93.1 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C20 (at -0.245 -2.54 270) (layer F.SilkS))
    (fp_text value 0.033µF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 12 "Net-(C20-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 55 /TAS3251/SPK_OUTA-))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 140.97 110.118 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C21 (at -3.42 0 90) (layer F.SilkS))
    (fp_text value 0.033µF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 57 /TAS3251/SPK_OUTB-))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 13 "Net-(C21-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 113.03 106.435 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C22 (at -3.801 0 90) (layer F.SilkS))
    (fp_text value 0.047µF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 14 /TAS3251/C_START))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 113.03 79.62 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C23 (at 0 -1.65 90) (layer F.SilkS))
    (fp_text value 1000pF (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 /TAS3251/INB-))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 /TAS3251/INB+))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 112.395 85.48 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C24 (at 0 -1.65 270) (layer F.SilkS))
    (fp_text value 1000pF (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 17 /TAS3251/INA+))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 /TAS3251/INA-))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 106.8975 108.585)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C25 (at -5.2975 0) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 15 /TAS3251/INB-))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 19 SPK_INB-))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 106.4625 106.045)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C26 (at -4.8625 0) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 20 SPK_INB+))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 16 /TAS3251/INB+))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 108.585 99.695 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C27 (at -4.8625 0 270) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 18 /TAS3251/INA-))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 21 SPK_INA-))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 112.395 99.2775 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C28 (at -4.8625 0 270) (layer F.SilkS))
    (fp_text value 10µF (at 0 1.82 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 22 SPK_INA+))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 17 /TAS3251/INA+))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 225.0075 45.72)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C33 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 1000pF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 62 OUTA+))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 226.06 71.12)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C34 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 1000pF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 61 OUTA-))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5C8C08E0)
    (at 220.98 132.08)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C35 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 1000pF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175)
      (net 60 OUTB+))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer F.Cu) (tedit 5B301BBE)
    (at 184.404 143.764)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C36 (at 0 -1.82) (layer F.SilkS))
    (fp_text value 1000pF (at 0 1.82) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 59 OUTB-))
    (pad 1 smd roundrect (at -1.4875 0) (size 1.425 1.75) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 114.808 11.938 270)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C37 (at 0 1.82 270) (layer B.SilkS))
    (fp_text value 4.7µF (at 0 -1.82 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 23 15V))
    (pad 2 smd roundrect (at 1.4875 0 270) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 106.934 11.185 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C39 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 0.47µF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 23 15V))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 125.73 45.3025 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C41 (at 0 1.82 90) (layer B.SilkS))
    (fp_text value 1µF (at 0 -1.82 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 3 VDD))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 123.19 45.085 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C43 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 0.01µF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 3 VDD))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5C9E81FC)
    (at 85.09 6.976 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C51 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 0.1µF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217)
      (net 50 +12V))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 109.728 122.682 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D1 (at 0 -1.65 180) (layer F.SilkS))
    (fp_text value Orange (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 25 \CLIP_OTW))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 26 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 109.728 119.888 180)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D2 (at 0 -1.65 180) (layer F.SilkS))
    (fp_text value Red (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 27 "Net-(D2-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 28 \FAULT))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 86.995 6.976 90)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D4 (at 0 -1.65 90) (layer F.SilkS))
    (fp_text value Green (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 29 "Net-(D4-Pad2)"))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module LED_SMD:LED_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B4B45C9)
    (at 92.465 68.58)
    (descr "LED SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "LED handsolder")
    (attr smd)
    (fp_text reference D5 (at 0 -1.65) (layer F.SilkS))
    (fp_text value Green (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 30 "Net-(D5-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/LED_SMD.3dshapes/LED_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5C93F836)
    (at 120.65 99.45 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R1 (at 0 1.65 90) (layer B.SilkS))
    (fp_text value 10.0k (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 37 MODE))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 92.32 104.14)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R2 (at 0 -1.65) (layer F.SilkS))
    (fp_text value 10.0k (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 38 ADR))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 128.279 99.695 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R3 (at 0 1.65 180) (layer B.SilkS))
    (fp_text value 22.0k (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 39 /TAS3251/OC_ADJ))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 115.424814 122.871526 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R4 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 10.0k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 36 "Net-(J2-Pad4)"))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 117.964814 122.871526 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R5 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 20.0k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 35 "Net-(J2-Pad6)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 120.65 122.871526 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R6 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 30.0k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 34 "Net-(J2-Pad8)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 116.84 81.28 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R8 (at 0 -1.65 180) (layer F.SilkS))
    (fp_text value 499 (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 40 /TAS3251/DAC_OUTB-))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 /TAS3251/INB-))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 116.84 78.105 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R9 (at 0 -1.65 180) (layer F.SilkS))
    (fp_text value 499 (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 /TAS3251/INB+))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 41 /TAS3251/DAC_OUTB+))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 116.595 84.455 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R10 (at 0 -1.65 180) (layer F.SilkS))
    (fp_text value 499 (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 /TAS3251/INA-))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 42 /TAS3251/DAC_OUTA+))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 116.45 87.63 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R11 (at 0 -1.65 180) (layer F.SilkS))
    (fp_text value 499 (at 0 1.65 180) (layer F.Fab))
    (fp_text user %R (at 0 0 180) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 43 /TAS3251/DAC_OUTA-))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 17 /TAS3251/INA+))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 109.22 81.67 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R12 (at 0 -1.65 90) (layer F.SilkS))
    (fp_text value 100k (at 0 1.65 90) (layer F.Fab))
    (fp_text user %R (at 0 0 90) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 15 /TAS3251/INB-))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 109.22 77.352 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R13 (at 0 -1.65 270) (layer F.SilkS))
    (fp_text value 100k (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 16 /TAS3251/INB+))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 106.045 83.82 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R14 (at 0 -1.65 270) (layer F.SilkS))
    (fp_text value 100k (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 18 /TAS3251/INA-))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 109.22 88.02 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R15 (at 0 -1.65 270) (layer F.SilkS))
    (fp_text value 100k (at 0 1.65 270) (layer F.Fab))
    (fp_text user %R (at 0 0 270) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 17 /TAS3251/INA+))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 110.346604 122.697443 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R16 (at 0 1.65 180) (layer B.SilkS))
    (fp_text value 560 (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 26 "Net-(D1-Pad1)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 110.266868 119.808481 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R17 (at 0 1.65 180) (layer B.SilkS))
    (fp_text value 560 (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 27 "Net-(D2-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 1 +3V3))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 85.97 3.175 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R24 (at 0 1.65 180) (layer B.SilkS))
    (fp_text value 1.50k (at 0 -1.65 180) (layer B.Fab))
    (fp_text user %R (at 0 0 180) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 29 "Net-(D4-Pad2)"))
    (pad 2 smd roundrect (at 1.025 0 180) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer F.Cu) (tedit 5B36C52B)
    (at 96.91 68.58)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R25 (at 0 -1.65) (layer F.SilkS))
    (fp_text value 499 (at 0 1.65) (layer F.Fab))
    (fp_text user %R (at 0 0) (layer F.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.217391)
      (net 30 "Net-(D5-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 102.235 80.645)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP1 (at 0 -1.998) (layer F.SilkS))
    (fp_text value GND (at 0 2.05) (layer F.Fab))
    (fp_text user %R (at 0 -2) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers F.Cu F.Mask)
      (net 2 GND))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 90.805 92.71 270)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP2 (at 0 -1.998 270) (layer F.SilkS))
    (fp_text value MCLK (at 0 2.05 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd circle (at 0 0 270) (size 2 2) (layers F.Cu F.Mask)
      (net 44 MCLK))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 93.345 95.25 270)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP3 (at 0 -1.998 270) (layer F.SilkS))
    (fp_text value BCLK (at 0 2.05 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd circle (at 0 0 270) (size 2 2) (layers F.Cu F.Mask)
      (net 45 BCLK))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 94.615 100.33 270)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP4 (at 0 -1.998 270) (layer F.SilkS))
    (fp_text value LRCK (at 0 2.05 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd circle (at 0 0 270) (size 2 2) (layers F.Cu F.Mask)
      (net 46 LRCK))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 91.44 97.79 270)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP5 (at 0 -1.998 270) (layer F.SilkS))
    (fp_text value SDIN (at 0 2.05 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd circle (at 0 0 270) (size 2 2) (layers F.Cu F.Mask)
      (net 47 SDIN))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 93.345 87.63 270)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP6 (at 0 -1.998 270) (layer F.SilkS))
    (fp_text value SCL (at 0 2.05 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd circle (at 0 0 270) (size 2 2) (layers F.Cu F.Mask)
      (net 48 SCL))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5C9E83F3)
    (at 72.39 17.399 270)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP7 (at 0 1.998 270) (layer B.SilkS))
    (fp_text value DAC-AVDD (at 0 -2.05 270) (layer B.Fab))
    (fp_text user %R (at 0 2 270) (layer B.Fab))
    (pad 1 smd circle (at 0 0 270) (size 2 2) (layers B.Cu B.Mask)
      (net 1 +3V3))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 90.805 85.09 270)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP8 (at 0 -1.998 270) (layer F.SilkS))
    (fp_text value SDA (at 0 2.05 270) (layer F.Fab))
    (fp_text user %R (at 0 -2 270) (layer F.Fab))
    (pad 1 smd circle (at 0 0 270) (size 2 2) (layers F.Cu F.Mask)
      (net 49 SDA))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5A0F774F)
    (at 128.905 102.235)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP9 (at 0 1.998) (layer B.SilkS))
    (fp_text value OC-ADJ (at 0 -2.05) (layer B.Fab))
    (fp_text user %R (at 0 2) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers B.Cu B.Mask)
      (net 39 /TAS3251/OC_ADJ))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 144.78 117.475)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP10 (at 0 -1.998) (layer F.SilkS))
    (fp_text value GVDD_A (at 0 2.05) (layer F.Fab))
    (fp_text user %R (at 0 -2) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers F.Cu F.Mask)
      (net 50 +12V))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5A0F774F)
    (at 127 97.155)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP11 (at 0 1.998) (layer B.SilkS))
    (fp_text value GVDD_B (at 0 -2.05) (layer B.Fab))
    (fp_text user %R (at 0 2) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers B.Cu B.Mask)
      (net 50 +12V))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5A0F774F)
    (at 128.905 105.537)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP12 (at 0 1.998) (layer B.SilkS))
    (fp_text value AVDD (at 0 -2.05) (layer B.Fab))
    (fp_text user %R (at 0 2) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers B.Cu B.Mask)
      (net 4 /TAS3251/AVDD))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 110.49 104.14)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP13 (at 0 -1.998) (layer F.SilkS))
    (fp_text value DVDD (at 0 2.05) (layer F.Fab))
    (fp_text user %R (at 0 -2) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers F.Cu F.Mask)
      (net 5 /TAS3251/DVDD))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 166.37 101.6)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP14 (at 0 -1.998) (layer F.SilkS))
    (fp_text value PVDD_B (at 0 2.05) (layer F.Fab))
    (fp_text user %R (at 0 -2) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers F.Cu F.Mask)
      (net 3 VDD))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 166.37 96.52)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP15 (at 0 -1.998) (layer F.SilkS))
    (fp_text value PVDD_A (at 0 2.05) (layer F.Fab))
    (fp_text user %R (at 0 -2) (layer F.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers F.Cu F.Mask)
      (net 3 VDD))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5C8C0298)
    (at 158.242 93.853)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP16 (at 0 1.998) (layer B.SilkS))
    (fp_text value OUTA+ (at 0 -2.05) (layer B.Fab))
    (fp_text user %R (at 0 2) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers B.Cu B.Mask)
      (net 58 /TAS3251/SPK_OUTA+))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5A0F774F)
    (at 158.115 99.06)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP17 (at 0 1.998) (layer B.SilkS))
    (fp_text value OUTA- (at 0 -2.05) (layer B.Fab))
    (fp_text user %R (at 0 2) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers B.Cu B.Mask)
      (net 55 /TAS3251/SPK_OUTA-))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5A0F774F)
    (at 158.115 104.14)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP18 (at 0 1.998) (layer B.SilkS))
    (fp_text value OUTB+ (at 0 -2.05) (layer B.Fab))
    (fp_text user %R (at 0 2) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers B.Cu B.Mask)
      (net 56 /TAS3251/SPK_OUTB+))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer B.Cu) (tedit 5A0F774F)
    (at 158.115 109.22)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP19 (at 0 1.998) (layer B.SilkS))
    (fp_text value OUTB- (at 0 -2.05) (layer B.Fab))
    (fp_text user %R (at 0 2) (layer B.Fab))
    (pad 1 smd circle (at 0 0) (size 2 2) (layers B.Cu B.Mask)
      (net 57 /TAS3251/SPK_OUTB-))
  )
  (module TestPoint:TestPoint_Pad_D2.0mm (layer F.Cu) (tedit 5A0F774F)
    (at 106.172 122.682 180)
    (descr "SMD pad as test Point, diameter 2.0mm")
    (tags "test point SMD pad")
    (attr virtual)
    (fp_text reference TP20 (at 0 -1.998 180) (layer F.SilkS))
    (fp_text value CLIP_OTW (at 0 2.05 180) (layer F.Fab))
    (fp_text user %R (at 0 -2 180) (layer F.Fab))
    (pad 1 smd circle (at 0 0 180) (size 2 2) (layers F.Cu F.Mask)
      (net 25 \CLIP_OTW))
  )
  (module TAS3251:DKQ0056A (layer F.Cu) (tedit 5CA11611)
    (at 129.21 98.1075)
    (attr smd)
    (fp_text reference U1 (at 0 0) (layer F.SilkS) hide)
    (fp_text value TAS3251 (at 0 0) (layer F.SilkS))
    (pad 28 smd oval (at -4.75 8.5725 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 28 \FAULT))
    (pad 27 smd oval (at -4.75 7.9375 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 52 \RESET-AMP))
    (pad 25 smd oval (at -4.75 6.6675 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 20 SPK_INB+))
    (pad 24 smd oval (at -4.75 6.0325 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 14 /TAS3251/C_START))
    (pad 26 smd oval (at -4.75 7.3025 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 19 SPK_INB-))
    (pad 21 smd oval (at -4.75 4.1275 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 5 /TAS3251/DVDD))
    (pad 23 smd oval (at -4.75 5.3975 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 4 /TAS3251/AVDD))
    (pad 22 smd oval (at -4.75 4.7625 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 20 smd oval (at -4.75 3.4925 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 32 /TAS3251/OSC-IOP))
    (pad 19 smd oval (at -4.75 2.8575 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 31 /TAS3251/OSC-IOM))
    (pad 18 smd oval (at -4.75 2.2225 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 33 /TAS3251/FREQ_ADJ))
    (pad 17 smd oval (at -4.75 1.5875 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 39 /TAS3251/OC_ADJ))
    (pad 16 smd oval (at -4.75 0.9525 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 21 SPK_INA-))
    (pad 15 smd oval (at -4.75 0.3175 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 22 SPK_INA+))
    (pad 14 smd oval (at -4.75 -0.3175 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 37 MODE))
    (pad 13 smd oval (at -4.75 -0.9525 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 11 smd oval (at -4.75 -2.2225 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 8 "Net-(C10-Pad1)"))
    (pad 12 smd oval (at -4.75 -1.5875 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 50 +12V))
    (pad 10 smd oval (at -4.75 -2.8575 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 7 smd oval (at -4.75 -4.7625 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 6 smd oval (at -4.75 -5.3975 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 6 "Net-(C9-Pad1)"))
    (pad 9 smd oval (at -4.75 -3.4925 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (pad 8 smd oval (at -4.75 -4.1275 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 7 "Net-(C9-Pad2)"))
    (pad 5 smd oval (at -4.75 -6.0325 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 11 "Net-(C19-Pad2)"))
    (pad 4 smd oval (at -4.75 -6.6675 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 43 /TAS3251/DAC_OUTA-))
    (pad 3 smd oval (at -4.75 -7.3025 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 42 /TAS3251/DAC_OUTA+))
    (pad 2 smd oval (at -4.75 -7.9375 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 40 /TAS3251/DAC_OUTB-))
    (pad 1 smd oval (at -4.75 -8.5725 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 41 /TAS3251/DAC_OUTB+))
    (pad 29 smd oval (at 4.75 8.5725 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 25 \CLIP_OTW))
    (pad 30 smd oval (at 4.75 7.9375 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 50 +12V))
    (pad 31 smd oval (at 4.75 7.3025 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 13 "Net-(C21-Pad2)"))
    (pad 32 smd oval (at 4.75 6.6675 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 10 "Net-(C18-Pad2)"))
    (pad 33 smd oval (at 4.75 6.0325 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 34 smd oval (at 4.75 5.3975 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 57 /TAS3251/SPK_OUTB-))
    (pad 35 smd oval (at 4.75 4.7625 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 3 VDD))
    (pad 36 smd oval (at 4.75 4.1275 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 56 /TAS3251/SPK_OUTB+))
    (pad 37 smd oval (at 4.75 3.4925 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (zone_connect 1) (thermal_gap 0.2))
    (pad 38 smd oval (at 4.75 2.8575 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND) (zone_connect 1) (thermal_gap 0.2))
    (pad 40 smd oval (at 4.75 1.5875 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 3 VDD))
    (pad 39 smd oval (at 4.75 2.2225 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 55 /TAS3251/SPK_OUTA-))
    (pad 41 smd oval (at 4.75 0.9525 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 58 /TAS3251/SPK_OUTA+))
    (pad 42 smd oval (at 4.75 0.3175 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 43 smd oval (at 4.75 -0.3175 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 12 "Net-(C20-Pad2)"))
    (pad 44 smd oval (at 4.75 -0.9525 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 9 "Net-(C17-Pad2)"))
    (pad 45 smd oval (at 4.75 -1.5875 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 53 \DAC_MUTE))
    (pad 47 smd oval (at 4.75 -2.8575 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 46 LRCK))
    (pad 46 smd oval (at 4.75 -2.2225 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 38 ADR))
    (pad 48 smd oval (at 4.75 -3.4925 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 47 SDIN))
    (pad 49 smd oval (at 4.75 -4.1275 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 45 BCLK))
    (pad 50 smd oval (at 4.75 -4.7625 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 44 MCLK))
    (pad 51 smd oval (at 4.75 -5.3975 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 54 SDOUT))
    (pad 52 smd oval (at 4.75 -6.0325 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (pad 53 smd oval (at 4.75 -6.6675 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 48 SCL))
    (pad 54 smd oval (at 4.75 -7.3025 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 49 SDA))
    (pad 55 smd oval (at 4.75 -7.9375 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 2 GND))
    (pad 56 smd oval (at 4.75 -8.5725 90) (size 0.4 1.9) (layers F.Cu F.Paste F.Mask)
      (net 1 +3V3))
    (model ./wrlshp/1EED193E-2F53.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:TO-252-2 (layer B.Cu) (tedit 5A70A390)
    (at 80.01 12.7 270)
    (descr "TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/")
    (tags "DPAK TO-252 DPAK-3 TO-252-3 SOT-428")
    (attr smd)
    (fp_text reference U2 (at 0 4.5 270) (layer B.SilkS))
    (fp_text value TLV1117-33 (at 0 -4.5 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd rect (at -4.2 2.28 270) (size 2.2 1.2) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -4.2 -2.28 270) (size 2.2 1.2) (layers B.Cu B.Paste B.Mask)
      (net 50 +12V))
    (pad 2 smd rect (at 2.1 0 270) (size 6.4 5.8) (layers B.Cu B.Mask)
      (net 1 +3V3))
    (pad "" smd rect (at 3.775 -1.525 270) (size 3.05 2.75) (layers B.Paste))
    (pad "" smd rect (at 0.425 1.525 270) (size 3.05 2.75) (layers B.Paste))
    (pad "" smd rect (at 3.775 1.525 270) (size 3.05 2.75) (layers B.Paste))
    (pad "" smd rect (at 0.425 -1.525 270) (size 3.05 2.75) (layers B.Paste))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/TO-252-2.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Package_TO_SOT_SMD:SOT-223 (layer B.Cu) (tedit 5A02FF57)
    (at 101.6 6.452 90)
    (descr "module CMS SOT223 4 pins")
    (tags "CMS SOT")
    (attr smd)
    (fp_text reference U3 (at 0 4.5 90) (layer B.SilkS))
    (fp_text value LM2940IMP-12/NOPB (at 0 -4.5 90) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 4 smd rect (at 3.15 0 90) (size 2 3.8) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 2 smd rect (at -3.15 0 90) (size 2 1.5) (layers B.Cu B.Paste B.Mask)
      (net 2 GND))
    (pad 3 smd rect (at -3.15 -2.3 90) (size 2 1.5) (layers B.Cu B.Paste B.Mask)
      (net 24 "Net-(C47-Pad1)"))
    (pad 1 smd rect (at -3.15 2.3 90) (size 2 1.5) (layers B.Cu B.Paste B.Mask)
      (net 23 15V))
    (model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-223.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_1206_3216Metric_Pad1.42x1.75mm_HandSolder (layer B.Cu) (tedit 5B301BBE)
    (at 89.535 7.3295 90)
    (descr "Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C38 (at 0 1.82 90) (layer B.SilkS))
    (fp_text value 10µF (at 0 -1.82 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -1.4875 0 90) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 50 +12V))
    (pad 2 smd roundrect (at 1.4875 0 90) (size 1.425 1.75) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.175439)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_1206_3216Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 137.48009 6.68333 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C45 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 0.1µF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 3 VDD))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 134.94009 6.68333 270)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C46 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 4700pF (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 63 "Net-(C46-Pad1)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 122.86609 7.154728)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C48 (at 0 1.65) (layer B.SilkS))
    (fp_text value 0.1µF (at 0 -1.65) (layer B.Fab))
    (fp_text user %R (at 0 0) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 51 "Net-(C48-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 137.09909 14.257728 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C49 (at 0 1.65 90) (layer B.SilkS))
    (fp_text value 0.047µF (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 64 "Net-(C49-Pad1)"))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 65 "Net-(C49-Pad2)"))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Capacitor_SMD:C_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 134.81309 14.257728 90)
    (descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "capacitor handsolder")
    (attr smd)
    (fp_text reference C50 (at 0 1.65 90) (layer B.SilkS))
    (fp_text value 5600pF (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 66 "Net-(C50-Pad2)"))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 23 15V))
    (model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_2x14_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 85.09 80.01)
    (descr "Through hole straight pin header, 2x14, 2.54mm pitch, double rows")
    (tags "Through hole pin header THT 2x14 2.54mm double row")
    (fp_text reference J11 (at 1.27 -2.33) (layer F.SilkS))
    (fp_text value Conn_02x14_Odd_Even (at 1.27 35.35) (layer F.Fab))
    (fp_text user %R (at 1.27 16.51 -270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 62 OUTA+))
    (pad 2 thru_hole oval (at 2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 61 OUTA-))
    (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 4 thru_hole oval (at 2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 6 thru_hole oval (at 2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 49 SDA))
    (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 8 thru_hole oval (at 2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 48 SCL))
    (pad 9 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 10 thru_hole oval (at 2.54 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 54 SDOUT))
    (pad 11 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 12 thru_hole oval (at 2.54 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 44 MCLK))
    (pad 13 thru_hole oval (at 0 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 14 thru_hole oval (at 2.54 15.24) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 45 BCLK))
    (pad 15 thru_hole oval (at 0 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 16 thru_hole oval (at 2.54 17.78) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 47 SDIN))
    (pad 17 thru_hole oval (at 0 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 18 thru_hole oval (at 2.54 20.32) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 46 LRCK))
    (pad 19 thru_hole oval (at 0 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 20 thru_hole oval (at 2.54 22.86) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 ADR))
    (pad 21 thru_hole oval (at 0 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask))
    (pad 22 thru_hole oval (at 2.54 25.4) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 53 \DAC_MUTE))
    (pad 23 thru_hole oval (at 0 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 25 \CLIP_OTW))
    (pad 24 thru_hole oval (at 2.54 27.94) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 52 \RESET-AMP))
    (pad 25 thru_hole oval (at 0 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 28 \FAULT))
    (pad 26 thru_hole oval (at 2.54 30.48) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 MODE))
    (pad 27 thru_hole oval (at 0 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 59 OUTB-))
    (pad 28 thru_hole oval (at 2.54 33.02) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 60 OUTB+))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_2x14_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 93.98 115.57 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP1 (at 0 -2.33 180) (layer F.SilkS))
    (fp_text value Jumper_2_Bridged (at 0 4.87 180) (layer F.Fab))
    (fp_text user %R (at 0 1.27 270) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 37 MODE))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 95.885 106.68 180)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP2 (at 0 -2.33 180) (layer F.SilkS))
    (fp_text value Jumper_2_Bridged (at 0 4.87 180) (layer F.Fab))
    (fp_text user %R (at 0 1.27 270) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 2 GND))
    (pad 2 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 38 ADR))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 5C9E821E)
    (at 95.25 9.525 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP4 (at 0 -2.33 270) (layer F.SilkS))
    (fp_text value Jumper_2_Bridged (at 0 4.87 270) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 24 "Net-(C47-Pad1)"))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 50 +12V))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical (layer F.Cu) (tedit 59FED5CC)
    (at 129.54 50.8 270)
    (descr "Through hole straight pin header, 1x02, 2.54mm pitch, single row")
    (tags "Through hole pin header THT 1x02 2.54mm single row")
    (fp_text reference JP5 (at 0 -2.33 270) (layer F.SilkS))
    (fp_text value Jumper_2_Bridged (at 0 4.87 270) (layer F.Fab))
    (fp_text user %R (at 0 1.27) (layer F.Fab))
    (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 68 "Net-(D6-Pad2)"))
    (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)
      (net 3 VDD))
    (model ${KISYS3DMOD}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x02_P2.54mm_Vertical.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 123.25609 3.589728 270)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R7 (at 0 1.65 270) (layer B.SilkS))
    (fp_text value 4.99k (at 0 -1.65 270) (layer B.Fab))
    (fp_text user %R (at 0 0 270) (layer B.Fab))
    (pad 1 smd roundrect (at -1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 23 15V))
    (pad 2 smd roundrect (at 1.025 0 270) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 66 "Net-(C50-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (module Resistor_SMD:R_0805_2012Metric_Pad1.15x1.40mm_HandSolder (layer B.Cu) (tedit 5B36C52B)
    (at 120.71609 3.589728 90)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
    (tags "resistor handsolder")
    (attr smd)
    (fp_text reference R18 (at 0 1.65 90) (layer B.SilkS))
    (fp_text value 1.00k (at 0 -1.65 90) (layer B.Fab))
    (fp_text user %R (at 0 0 90) (layer B.Fab))
    (pad 2 smd roundrect (at 1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 2 GND))
    (pad 1 smd roundrect (at -1.025 0 90) (size 1.15 1.4) (layers B.Cu B.Paste B.Mask) (roundrect_rratio 0.217391)
      (net 66 "Net-(C50-Pad2)"))
    (model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
      (at (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (zone (net 3) (net_name VDD) (layer F.Cu) (hatch edge 0.508)
    (priority 66)
    (connect_pads thru_hole_only (clearance 0.09144))
    (min_thickness 0.254)
    (fill yes (mode segment) (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 148.66499 37.717316) (xy 155.28999 37.717306) (xy 169.28999 51.717306) (xy 169.28998 116.717306) (xy 161.29 124.717306)
        (xy 158.28999 124.717306) (xy 157.28999 123.717306) (xy 157.28999 120.717306) (xy 159.28999 118.717306) (xy 161.28999 118.717306)
        (xy 162.28999 117.717306) (xy 162.28999 53.717306) (xy 156.28999 47.717316) (xy 148.66499 47.717306)
      )
    )
  )
  (zone (net 3) (net_name VDD) (layer F.Cu) (hatch edge 0.508)
    (priority 65)
    (connect_pads thru_hole_only (clearance 0.09144))
    (min_thickness 0.254)
    (fill yes (mode segment) (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 133.035 99.511138) (xy 136.235 99.511128) (xy 137.985 97.761128) (xy 137.922 96.393) (xy 140.081 96.393)
        (xy 157.18499 80.511138) (xy 157.18499 78.561138) (xy 157.98501 77.761128) (xy 163.18499 77.761128) (xy 163.18499 83.761138)
        (xy 161.18499 83.761138) (xy 146.685 98.261128) (xy 138.93499 98.261138) (xy 136.906 100.203) (xy 135.956 100.203)
        (xy 135.40999 99.936128) (xy 133.03499 99.936138)
      )
    )
  )
  (zone (net 3) (net_name VDD) (layer F.Cu) (hatch edge 0.508)
    (priority 67)
    (connect_pads thru_hole_only (clearance 0.09144))
    (min_thickness 0.254)
    (fill yes (mode segment) (arc_segments 32) (thermal_gap 0.508) (thermal_bridge_width 0.508))
    (polygon
      (pts
        (xy 133.04 103.184) (xy 136.24 103.18401) (xy 137.99 104.93401) (xy 137.922 106.045) (xy 140.208 106.045)
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